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Standard size of semiconductor wafer will be 200mm to 300mm in coming years And the number of integrated circuits that can be formed on a single wafer will further increase.Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.).Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.).
Chemical vapor deposition apparatus for depositing a substantially uniform thin film or layer on a substrate or wafer. The apparatus includes a chamber having an injector assembly that includes spaced linear injectors, and a species supply system for supplying species to the injector to form spaced adjacent deposition regions. Transfer means reciprocally move the substrate or wafer a predetermined distance in a direction perpendicular to the longitudinal axis of the linear injector, maintaining the substrate surface parallel and adjacent to the species delivery surface of the linear injector assembly., So that the deposition areas of adjacent injectors form a thin film or layer of substantially uniform thickness. The material is typically loaded on a conveyor using automated equipment to control the flow of the material. Automated equipment is also used to remove material at the exit point. ![]() In some applications, including semiconductor processing, material must be temporarily removed from the conveyor to one or more workstations along the conveyor path. The material is later returned to the conveyor, which transports the material to the next workstation or exit point. In order to be able to achieve the movement of material between the conveyor and the workstation along the aisle, care must be taken that transport is achieved without significant interruption of material flow on the conveyor. No. A system that efficiently and conveniently transfers material between a conveyor system and a workstation without obstructing the flow of material on the conveyor is desirable. In this field, conveyors can be used to transport semiconductor wafers or other substrates to different processing machines or to transport reticles from stockers to steppers. The material (i.e., wafer or reticle) must be transferred to a machine for processing, and after processing is complete, returned to the conveyor for delivery to the next processing machine. To minimize exposure of the substrate to the environment outside the processing machine and to protect the material from particulate contamination, the material is typically held in a protective container such as a sealed transport pod. At the entrance of each processing machine is a load port designed to automatically remove material from the transport pod into a protected environment. During operation of the device, the material must frequently be moved between the load port and the conveyor. Various systems (called intra-compartment transport systems) are used to move material between machines in a compartment. For example, many systems rely on workers to transfer materials from port to port using carts. Failed To Load Profile Due To Another Instance Of Easyworship Manual Robotic LinkWorkers typically activate a manual robotic link or other lifting device to move material into the port and return the transport pod to the cart after processing is complete. Another intra-compartment transportation system relies on an automatic guided vehicle (AGV) to carry pods between machines and move the pods automatically into a load port. Carts and AGVs have the advantages associated with automated conveyors (i.e., articles can be moved efficiently and quickly along conveyors, and have much greater capacity than carts and AGVs). Integrated circuits are manufactured by forming multiple layers on a semiconductor wafer or other substrate. As technology advances, integrated circuits become increasingly complex and typically include multiple layers of complex wiring. By reducing the size of integrated circuits, the number of integrated circuits positioned on a single wafer has increased.
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